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CAS NO. 25587-80-8 Molecular formula:(C11H23NO2)x
It is made by high temperature reaction of dimeric acid and polyamine.Soluble in general organic solvents, its heating melting viscosity and heating temperature has a great relationship. It has the characteristics of low viscosity, good flow performance, good toughness and high bond strength.
1. It has good low temperature solubility and soluble fusibility
2. It has high thermal stability.
3. It has strong flexibility.
1. Hot melt adhesive for electronic and electrical shrinkable materials.
2. shoe material, clothing, leather and other hot glue.
3. hot melt adhesive, etc
Type | Index | ||||
Chroma(Fe-Co) | Viscosity(Mpa.s/25℃) | Acid value(mgKOH/g) | Amine value(mgKOH/g) |
Softening point ℃ |
|
CXD-01 | ≤7# | 150~250 | ≤6 | ≤5 |
110±5 |
CXD-02 | ≤7# | 250~350 | ≤6 | ≤5 |
120±5 |
Two-in-one paper-plastic packaging bag, 25KG/ bag.
Tel: 0571-86617528
Email: hyh@hofcc.com
Tel: 0571- 88292150 82900658
Email: trade@hofcc.com chenmin@zanyu.com